Summary: This technical article from Advanced Thermal Solutions highlights how AI chips’ dramatically rising power demands drive the need for advanced thermal management at both the chip and system levels. It explains the increasing thermal design power (TDP) of modern GPUs and AI processors and discusses the role of liquid cooling, heat sinks, and other solutions in preventing overheating, maintaining performance, and ensuring long-term reliability of high-power components used in AI workloads. 
Source Link: https://www.qats.com/cms/2025/02/20/thermal-management-for-ai-chips/